Automotive Grade PdCu Bonding Wire For Power Modules

Major Application Areas

1️⃣ Semiconductor Packaging Bonding Wire

In integrated circuit (IC) packaging, PCC wire serves as a replacement for traditional gold wire and is widely used in:

• QFN / QFP / SOP packages

• LED packaging

• Power semiconductor packaging

• Automotive-grade chip packaging

Compared with conventional gold bonding wire, PCC offers:

• Significantly reduced material cost

• Higher mechanical strength

• Excellent electromigration resistance

• Palladium layer effectively suppresses oxidation and improves storage stability

Current mainstream packaging structures include AuPdCu and highly stable PdCu design configurations.

2️⃣ LED Packaging Industry

In the electrical interconnection between LED chips and lead frames, PCC wire provides:

• Excellent electrical conductivity

• High thermal stability

• Reliable performance under long-term high-temperature operation

In mid-to-high-end lighting and automotive LED applications, PCC has gradually replaced pure gold wire solutions.

3️⃣ Power Semiconductors & Automotive Electronics

PCC wire is widely applied in:

• IGBT modules

• MOSFET devices

• Automotive-grade MCUs

• New energy electric drive modules

The palladium coating effectively reduces interface embrittlement caused by copper oxidation and maintains stable performance under high-temperature and high-humidity environments (e.g., 85°C / 85% RH testing).

In the new energy vehicle power module sector—such as modules integrated into supply chains serving companies like Tesla—bonding materials must meet extremely high durability standards. PCC wire is increasingly becoming one of the preferred materials in this field.

4️⃣ High-Frequency & Fine-Pitch Packaging

As chips continue to evolve toward:

• Smaller pitch

• Higher I/O density

• Thinner package profiles

Ultra-fine PCC wire (15–25 μm) has become the mainstream choice, particularly suitable for:

• AI chip packaging

• 5G communication chips

• High-performance computing (HPC) applications

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